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2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
AC and DC Operating Conditions
Table 59: I DD Specification Parameters and Operating Conditions (Continued)
Notes 1–3 apply to all parameters and conditions
Parameter/Condition
Self refresh current (–25?C to +85?C): CK = LOW, CK# = HIGH; CKE is LOW;
CA bus inputs are stable; Data bus inputs are stable; Maximum 1x self refresh
rate
Self refresh current (+85?C to +105?C): CK = LOW, CK# = HIGH; CKE is
LOW; CA bus inputs are stable; Data bus inputs are stable
Deep power-down current: CK = LOW, CK# = HIGH; CKE is LOW; CA bus in-
puts are stable; Data bus inputs are stable
Symbol
I DD61
I DD62
I DD6IN
I DD6ET1
I DD6ET2
I DD6ET,in
I DD81
I DD82
I DD8IN
Power Supply
V DD1
V DD2
V DDCA , V DDQ
V DD1
V DD2
V DDCA , V DDQ
V DD1
V DD2
V DDCA , V DDQ
Notes
7
7
4, 7
7, 8
7, 8
4, 7, 8
8
8
4, 8
Notes:
1. I DD values are the maximum of the distribution of the arithmetic mean.
2. I DD current specifications are tested after the device is properly initialized.
3. The 1x self refresh rate is the rate at which the device is refreshed internally during self
refresh, before going into the extended temperature range.
4. Measured currents are the sum of V DDQ and V DDCA .
5. Guaranteed by design with output reference load and R ON = 40 ohm.
6. Per-bank REFRESH is only applicable for LPDDR2-S4 device densities 1Gb or higher.
7. This is the general definition that applies to full-array self refresh.
8. I DD6ET and I DD8 are typical values, are sampled only, and are not tested.
AC and DC Operating Conditions
Operation or timing that is not specified is illegal. To ensure proper operation, the de-
vice must be initialized properly.
Table 60: Recommended DC Operating Conditions
LPDDR2-S4B
Symbol
Min
Typ
Max
Power Supply
Unit
V DD1
1
1.70
1.80
1.95
Core power 1
V
V DD2
V DDCA
V DDQ
1.14
1.14
1.14
1.20
1.20
1.20
1.30
1.30
1.30
Core power 2
Input buffer power
I/O buffer power
V
V
V
Note:
1. V DD1 uses significantly less power than V DD2 .
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
117
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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